Manual dismantling is engaged in the initial processes Sorting of reusable components from e-waste
Raw shredding, crushing for Size Reduction and change of shape for downstream processing And Ferrous content separation
Shredding of non ferrous parts for their downstream processing
Removal of IC, Other electronic components, All solid components, Edge connections & Any metals from Printed Circuit Board
Size and Shape compatibility and reduction for maximal homogeneity, downstream mixing and later extrusion
Convert waste plastic into usable granules
Removal of Copper, Iron, Aluminium and other usable metallic items for sale